Networking boards use HDI to escape dense devices, but their channel loss, power delivery and connector transitions remain central design constraints.
What to consider
Choose layer allocation and material from the required channels. Avoid assuming the lowest Df laminate resolves via or connector discontinuities. Dense switches and processors also require substantial power and heat management, so reserve plane area and thermal paths before maximizing routing density.
A practical review example
Build a representative channel model from device package to connector. Use it to compare a core routing layer, build-up routing and transition choices on the proposed stackup.
Checks before release
- Budget package, via, route and connector contributions.
- Check copper roughness and construction-specific dielectric data.
- Coordinate signal, power and thermal reviews.
Connect this decision to fabrication
Use the material selector to organize the initial discussion. Keep proposed values separate from the approved drawing and document the effect of any change on the rest of the construction.
- Start with enclosure, interface and assembly constraints.
- Budget space for test access and rework.
- Qualify the final product for its actual use environment.
Technical references
HDI design and manufacturing overviewFabrication design guidelinesReferences checked 2 October 2026. Manufacturer data describes its stated construction and is not an HDIPCB.org manufacturing commitment.