HDI PCB Manufacturer
High Quality high-density interconnect PCB Manufacturing, blind via or/and buried hole, accept any layer of the PCB to be interconnected freely.
99.8%
Client retention
100% satisfy clients in our work
18+
Years of experience
Fully focused on HDI PCB manufacturing
1000+
Clients
Solid and responsible technical team
10K+
Project value
99.8% successfully all project done
HDI PCB SHOW
HIGH TECH MANUFACTURING
HDI PCB TYPES
HDI PCB (1+N+1)
- This structure of HDI PCB contains 1 “build-up” of high-density interconnection layers, suitable for BGA with lower I/O counts.
- It has fine lines, microvia and registration technologies capable of 0.4 mm ball pitch, excellent mounting stability and reliability, and may contain copper filled via.
- Applications: Cell phone, MP3 Player, GPS, Memory Card.
3 Step 3+N+3 HDI
Blind/Buried staggered vias , 8 Layers+ HDI PCB
2 Step 2+N+2 HDI
- This structure of HDI PCB contains 2 or more “build-up” of high-density interconnection layers; microvias on different layers can be staggered or stacked; Copper filled stacked microvia structures are commonly seen in challenging designs that demand high level signal transmission performance.
- These are suitable for BGA with smaller ball pitch and higher I/O counts and can be used to increase routing density in a complicated design while maintaining a thin finished board thickness.
- Applications: Cell phone, PDA, game console, portable video recording devices.
4 Step 4+N+4 HDI
Blind/Buried Vias, 10 Layers+ HDI PCB
ELIC (Every Layer Interconnection)
- In this HDI PCB structure, all the layers are high-density interconnection layers which allow the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures.
- This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices while producing superior electrical characteristics.
- Applications: Cell phone, ultra-mobile PC, MP3, GPS, Memory cards, small computer devices.
5 Step 5+N+5 HDI
5+N+5 Blind/Buried Vias, 12 Layers+ HDI PCB
Who We Are
We’re HDI PCB Manufacturer.
HDI PCB Manufacturing Capabiltiy : 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D.
- 2 Step – 2+N+2 Blind/Buried staggered vias
- 3 Step – 3+N+3 Blind/Buried staggered vias
- 4 Step – 4+N+4 Blind/Buried Vias
- 5 Step – 5+N+5 Blind/Buried Vias
What We Do
ELIC HDI PCB Manufacturing
ELIC (Every Layer InterConnect).All the layers of a PCB are high-density interconnection layers, which allows the conductors on any layer of the PCB to be interconnected freely with copper-filled stacked microvia structures (“any layer via”). This provides a reliable interconnect solution for highly complex, large pin count devices, such as central processing unit (CPU) and graphics processing unit (GPU) chips utilized on handheld and mobile devices.
HIGH DENSITY INTERCONNECT PCB
IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). There are different types of HDI features, type I, type II and type III as defined in IPC-2226. In our FAQ you can learn more about the different types.
Complex HDI Projects
Support R&D
HDI ROGERS PCB
rf bOARD
HDI RIGID FLEX
complex
ROGERS+FR4 HDI Board
Hybrid material
ELIC PCB
ANY LAYER HDI
From Our Blog Posts
Printed Circuit Board Technology
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What is the Buildup of a PCB?
PCB Layer Materials A PCB consists of alternating layers of conductive and insulating materials bonded together under heat and pressure. The conductive layers are typically copper foil, while the insulating layers are usually made of a glass-reinforced epoxy laminate called FR-4. Copper Foil Copper is used for the conductive layers […]
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What is Outer Annular Ring (OAR)?
Definition and Purpose of the Outer Annular Ring An Outer Annular Ring is a circular, ring-shaped component that is typically used in conjunction with bearings, seals, and other rotating parts. The primary purpose of an OAR is to provide a smooth, wear-resistant surface for these components to interact with, thereby […]
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PCB Events & Workshops
Introduction to PCBWorkshops PCBWorkshops are specialized events and workshops designed to provide participants with hands-on experience and knowledge in the field of printed circuit board (PCB) design, fabrication, and assembly. These workshops cater to a wide range of audiences, including students, hobbyists, engineers, and professionals in the electronics industry. The […]
100%
High Quality
100+
HDI Solution
1,000+
Global Customers
6,000+
Projects
HDI PCB Applications
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Smartphones and tablets
All smartphones are HDI PCBs with ELIC (Every Layer Interconnection) construction. The HDI PCBs are responsible for creating thinner are smaller portable electronic devices.
Automotive
Car manufacturers are extremely attracted to small-sized PCBs since they can save more space in the car. With the launch of futuristic cars from brands like Tesla, the integration of the electronic devices to provide a better driving experience has been the prime focus of the carmakers
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Consumer devices
Due to the compact nature, the HDI PCBs are used in most consumer products such as smartphones, tablets, laptop computers, touch screen products and home appliances.
Military and Aerospace
HDI is incorporated in military communications devices and other strategic equipment like missile and defence systems. The HDI PCBs are well suited for extreme environment and hazardous conditions making it ideal for aerospace and military applications.
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Wearable technology
With the launch of Apple watch and other wearable devices like VR headsets, HDI is becoming the major stakeholder in the consumer market. The wearable technology is gaining popularity among the young crowd due to its exceptional functionality.
Healthcare
The HDI PCB is making an impact on the medical industry. The medical devices are usually HDI since they can fit in small devices like implants and lab and imaging equipment. Medical equipment plays a crucial role in diagnosing diseases and also do provide life support. Ex: Pacemaker, Diagnostic and monitoring facilities.
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High-Density Interconnect (HDI) Printed Circuit Boards
6 Layer HDI PCB
10 Layer HDI PCB
