A dense bare board must also support repeatable solder assembly, inspection and rework. Involve the assembler before the pad and via structure is frozen.
What to consider
Coordinate land geometry, mask definition, via filling and stencil apertures. Confirm that filled pads meet the required surface condition and that board/panel support suits the component pitch. Inspection should address hidden joints; rework exposures belong in the microvia reliability review.
A practical review example
If a via-in-pad change solves escape routing, review paste volume and pad planarity with the assembler before releasing it. The routing improvement can otherwise introduce a solder-joint problem.
Checks before release
- Agree pad, mask and stencil geometry together.
- Review inspection and rework access.
- Include assembly thermal exposure in qualification.
Connect this decision to fabrication
Use the material selector to organize the initial discussion. Keep proposed values separate from the approved drawing and document the effect of any change on the rest of the construction.
- Start with enclosure, interface and assembly constraints.
- Budget space for test access and rework.
- Qualify the final product for its actual use environment.
Technical references
HDI design and manufacturing overviewFabrication design guidelinesReferences checked 2 October 2026. Manufacturer data describes its stated construction and is not an HDIPCB.org manufacturing commitment.