Manufacturing & DFM
Connect design intent to drilling, lamination, plating, inspection and release.
The HDI PCB manufacturing process
HDI fabrication builds the intended interconnect structure through a controlled sequence of imaging, lamination, drilling, metallization and inspection.
Manufacturing & DFMSequential lamination for HDI PCB
Sequential lamination adds layers in stages so internal interconnects can be formed before later copper and dielectric cover them.
Manufacturing & DFMLaser drilling for HDI microvias
Laser drilling creates small interconnect openings in selected dielectric layers. Material, copper treatment, depth control and subsequent cleaning all affect the result.
Manufacturing & DFMDesmear and metallization in HDI
A drilled microvia needs a prepared dielectric surface and a clean connection to its target copper before subsequent metallization and filling.
Manufacturing & DFMSolder mask around fine-pitch HDI pads
Solder-mask openings and remaining dams must fit the package land pattern and the factory’s registration capability. Mask color is not a substitute for a process specification.
Manufacturing & DFMSurface finish for fine-pitch HDI PCB
Choose surface finish for pad planarity, solderability, assembly process and storage requirements. A preferred finish still needs a compatible land and inspection plan.
Manufacturing & DFMPanelization and utilization for HDI PCB
Panelization affects material utilization, handling, tooling, test and assembly. The smallest individual board does not necessarily produce the lowest lot cost.
Manufacturing & DFMHow to read HDI manufacturing capability
A meaningful capability statement describes a combination of features supported in one construction. Maximum layer count and minimum hole diameter from different rows may not be simultaneously achievable.
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