A microsection reveals a local view of layers, holes and interfaces. It is useful evidence, but sampling and section position limit what it can prove.
What to consider
Review the location and construction represented by the section. A clean image does not establish the condition of every via, and a room-temperature section may not reveal latent thermal failures. Combine structural inspection with the electrical and stress evidence required for the product.
A practical review example
Ask for a section from a representative coupon showing the most demanding via combination, with the production lot and drawing revision identified. Interpret it with the agreed acceptance criteria.
Checks before release
- Identify coupon location and layer spans.
- Record measurement conventions and tolerances.
- Combine images with the appropriate electrical verification.
Connect this decision to fabrication
Use the design checklist to organize the initial discussion. Keep proposed values separate from the approved drawing and document the effect of any change on the rest of the construction.
- Specify acceptance and thermal exposure before requesting a quotation.
- Match coupon structure and process history to production.
- Review deviations and failure evidence with the responsible engineer.
Technical references
Historical IPC microvia reliability warning (2019)Fabrication design guidelinesReferences checked 2 October 2026. Manufacturer data describes its stated construction and is not an HDIPCB.org manufacturing commitment.