Bare-board electrical testing checks connectivity and isolation against the intended netlist. Its scope differs from impedance testing and thermal reliability testing.
What to consider
Dense boards can constrain probe access, so agree testability before panelization is frozen. Confirm which nets are tested and how the reference netlist is controlled. Continuity at room temperature does not prove signal performance or survival through assembly.
A practical review example
Reconcile the test netlist with the released design revision. If a manufacturing engineering change modifies the copper, document how the test reference is updated and approved.
Checks before release
- Define electrical-test coverage.
- Separate continuity, impedance and stress-test requirements.
- Retain lot and revision traceability.
Connect this decision to fabrication
Use the design checklist to organize the initial discussion. Keep proposed values separate from the approved drawing and document the effect of any change on the rest of the construction.
- Specify acceptance and thermal exposure before requesting a quotation.
- Match coupon structure and process history to production.
- Review deviations and failure evidence with the responsible engineer.
Technical references
Historical IPC microvia reliability warning (2019)Fabrication design guidelinesReferences checked 2 October 2026. Manufacturer data describes its stated construction and is not an HDIPCB.org manufacturing commitment.