HIGH-DENSITY INTERCONNECT · FROM DESIGN TO FABRICATIONPractical guidance for PCB designers

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Lamination guide

Understand the process implied by a symmetric build-up.

3 press steps

Illustrative count · 2+4+2 construction

Planning reference

CORELaminate the core; drill and plate internal interconnects

BUILD 1Add dielectric and copper to both sides. Drill, plate and fill per process.

BUILD 2Add dielectric and copper to both sides. Drill, plate and fill per process.

FINISHOuter circuitry, mask, finish and inspection

Counting convention: one press is assumed for the multilayer core; each symmetric build-up adds one press, not one per side. Additional sublaminations, buried-via steps or a different process can change the count. This is not a factory process traveler.

Planning aids. Confirm the final construction with your fabricator.Method & assumptions

How to use the result

Change the inputs to compare a design scenario. The result is a starting point for discussion and does not replace a package escape study, a field solver, a qualified fabrication process or a supplier quotation.

Method and assumptions

The simplified model counts one press for a multilayer core or zero for a purchased two-sided core, plus one press for each symmetric build-up. More internal sublaminations or different qualified processes change the count. The actual factory process sequence takes precedence.

What to confirm next

The package pin map, actual land pattern and usable routing channels.
Exact copper, pressed dielectric, via spans and material system.
Electrical targets, assembly exposure and acceptance requirements.

Send an inquiry with your assumptions and the decisions still open.

Your next design decision

Bring the requirements.
Start the right conversation.

Share your layer count, via structure, material and quantity. Give the fabrication review a clear starting point.

Discuss your HDI PCB [email protected]

Lamination guide