Microvias & interconnects
Make via diameter, depth, landing geometry and reliability evidence work together.
Blind vias in PCB design
A blind via connects an outer copper layer to an internal layer without extending through the full board. Its process depends on depth, diameter and the construction sequence.
Microvias & interconnectsBuried vias: construction and layer access
A buried via connects internal layers and becomes enclosed by later board processing. It must be formed and plated while the relevant subassembly is accessible.
Microvias & interconnectsBlind vs buried vs through vias
The distinction is where a via begins and ends. A blind via reaches inward from a surface, a buried via stays inside the finished board, and a through via crosses the board.
Microvias & interconnectsMicrovia aspect ratio: depth divided by diameter
Calculate microvia aspect ratio from the relevant dielectric depth and via diameter using a consistent convention. Obtain the factory limit for the actual shape, material and filling process.
Microvias & interconnectsStacked vs staggered microvias
Stacked microvias share a vertical location; staggered microvias offset successive transitions. The decision trades lateral routing area against construction and interface demands.
Microvias & interconnectsVia-in-pad for HDI PCB
Via-in-pad places an interconnect in a component land. It is a placement strategy and must be paired with a suitable filling and finishing process.
Microvias & interconnectsCopper-filled vs resin-filled vias
Copper filling and resin filling serve different construction needs. A plated barrel with resin and a copper cap is not the same structure as a copper-filled laser microvia.
Microvias & interconnectsMicrovia capture and target lands
A capture or target land must accommodate the intended hole, registration variation and the required copper connection. Reducing it changes both escape capacity and process margin.
Microvias & interconnectsMicrovia reliability and qualification
Reliable microvias require a qualified construction, controlled processing and test evidence that represents the finished board’s thermal exposure.
Microvias & interconnectsSkip microvias and multi-layer depth
A skip microvia bypasses an intermediate layer. Its greater dielectric depth and target access must be supported by a specifically qualified process.
Microvias & interconnectsVia stubs and backdrilling in HDI designs
HDI microvias can reduce unused interconnect length, but core through vias may still create stubs. Analyze the complete signal path.
Microvias & interconnectsWhat are Tented Vias?
What are Tented Vias: reference information, design-review checkpoints and related microvias & interconnects resources.
Microvias & interconnectsThrough-hole Technology in PCB Fabrication
Through-hole Technology in PCB Fabrication: reference information, design-review checkpoints and related microvias & interconnects resources.
Microvias & interconnectsThe Importance of Plated through-hole Technology in PCB Production
The Importance of Plated through-hole Technology in PCB Production: reference information, design-review checkpoints and related microvias & interconnects resources.
Microvias & interconnectsWhat is Outer Annular Ring (OAR)?
What is Outer Annular Ring (OAR): reference information, design-review checkpoints and related microvias & interconnects resources.
Microvias & interconnectsDrilled Holes in the PCB – all you need to know to avoid surprises.
Drilled Holes in the PCB – all you need to know to avoid surprises: reference information, design-review checkpoints and related microvias & interconnects resources.
Microvias & interconnectsTypes of PCB Drilled Holes
Types of PCB Drilled Holes: reference information, design-review checkpoints and related microvias & interconnects resources.
Microvias & interconnectsDrill & slot editor – a free and useful PCB Visualizer tool
Drill & slot editor – a free and useful PCB Visualizer tool: reference information, design-review checkpoints and related microvias & interconnects resources.
Microvias & interconnectsPCB Classification – pattern class and drill class
PCB Classification – pattern class and drill class: reference information, design-review checkpoints and related microvias & interconnects resources.
Microvias & interconnectsIs Via Bad for PCB?
Is Via Bad for PCB: reference information, design-review checkpoints and related microvias & interconnects resources.
Microvias & interconnectsWhy avoid vias?
Why avoid vias: reference information, design-review checkpoints and related microvias & interconnects resources.
Microvias & interconnectsWhy are Through Holes Preferred to Blind Holes?
Why are Through Holes Preferred to Blind Holes: reference information, design-review checkpoints and related microvias & interconnects resources.
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Bring the requirements.
Start the right conversation.
Share your layer count, via structure, material and quantity. Give the fabrication review a clear starting point.