HDI PCB (1+N+1)

• This structure of HDI PCB contains 1 “build-up” of high-density interconnection layers, suitable for BGA with lower I/O counts.
• It has fine lines, microvia and registration technologies capable of 0.4 mm ball pitch, excellent mounting stability and reliability, and may contain copper filled via.
• Applications: Cell phone, MP3 Player, GPS, Memory Card.

3 Step 3+N+3 HDI

Blind/Buried staggered vias , 8 Layers+ HDI PCB

2 Step 2+N+2 HDI

• This structure of HDI PCB contains 2 or more “build-up” of high-density interconnection layers; microvias on different layers can be staggered or stacked; Copper filled stacked microvia structures are commonly seen in challenging designs that demand high level signal transmission performance.
• These are suitable for BGA with smaller ball pitch and higher I/O counts and can be used to increase routing density in a complicated design while maintaining a thin finished board thickness.
• Applications: Cell phone, PDA, game console, portable video recording devices.

4 Step 4+N+4 HDI

Blind/Buried Vias, 10 Layers+ HDI PCB

ELIC (Every Layer Interconnection)

• In this HDI PCB structure, all the layers are high-density interconnection layers which allow the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures.
• This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices while producing superior electrical characteristics.
• Applications: Cell phone, ultra-mobile PC, MP3, GPS, Memory cards, small computer devices.

5 Step 5+N+5 HDI

5+N+5 Blind/Buried Vias, 12 Layers+ HDI PCB